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datashee t product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 tsz22111 ? 14 ? 001 www.rohm.com low power consumption class d amplifier 9w+9w analog input class d speaker amplifier BD28412MUV general description BD28412MUV is a 9w+9w stereo (or 18w monaural) class d amplifier, developed for battery equipped speaker systems such as wireless speaker s. this ic is incorporated with a precise oscillator to generate multiple switching frequencies that can avoid the am radio interference . in addition, 2.1ch audio system can be realized by master and slave operation without beat noise caused by interference between two ic s. furthermore, this ic achieves lower power consumption that eliminates the need for an external heat sink. features ? analog differential input ? low standby current ? output feedback circuitry prevents sound q ua lity degradation caused by powe r supply voltage fluctuation , achieve s low noise and low distortion, eliminates the need of large electrolytic-capacitors for decoupling ? power limit function (linearly-programmable) ? selectable switching frequency (am avoidance function) ? synchronization control is supported (selectable master and slave operation) ? parallel btl (pbtl) is supported ? wide voltage range (v cc =4.5v to 13v) ? high efficiency and l ow - heat -generation make the system smaller, thinner, and more power-saving ? pop noise p re vention during power supply on/off ? high reliability design by built- in protection circuits - overheat protection - under voltage protection - output short protection - output dc voltage protection ? small package (vqfn032v5050) achieves mount area reduction applications ? wireless speakers, small active speakers, portable audio equipments, etc. key specifications ? supply voltage range: 4.5v to 13v ? speaker output power: 9w+9w (typ) (v cc =12v, r l =8, plimit=0v ? speaker output power(pbtl): 18 w (typ) (v cc =12v, r l =4 , plimi t=0v) ? total harmonic distortion ratio: 0.03% (typ) @po=1w (v cc =1 1v, r l =8, plimit=0v ? crosstalk: 100db (typ) ? psrr: 55db (typ) ? output noise voltage: -80dbv (typ) ? standby current: 0.1a (typ) ? operating current: 16ma (typ) (no load or filter, no signal) ? operating temperature range: -25c to +85c package w(typ) x d(typ) x h(max) vqfn032v5050 5. 00 mm x 5.00mm x 1.00mm typical application circuit plimit in2p in1n pdx in1p audio source mute errorx out1p out1n out2p out2n in2n bsp2p bsp1p bsp1n bsp2n fsel<2:0> pdx mute other device sync gain_ ms_sel test sp ch1 (lch) sp ch2 (rch) vqfn032v5050 figure 1 . typical application circuit downloaded from: http:///
2/ 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV pin configuration 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 32 31 30 29 28 27 26 25 17 18 19 20 21 22 23 24 in1p in1n plimit gnda regg gain_ms_sel in2p in2n sync fsel0 fsel1 fsel2 mutex nc vccp2 bsp2n gndp1 out1n bsp1n bsp2p out2p gndp2 out2n errorx pdx test rega vcca vccp1 bsp1p out1p nc (top view) figure 2. pin configuration downloaded from: http:///
3/ 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV pin description pin no. pin name io function internal equivalent circuit 1 in1p i positive input pin for ch1 2 in1n i negative input pin for ch 1 3 plimit i power limit level setting pin 4 gnda - g nd pin for analog signal 5 regg o internal power supply pin for gate driver please connect a capacitor. the regg terminal of BD28412MUV should not be used as external supply. therefore, do not connect anything except the capacitor for stabilization and the resistors for setting of gain_ms_sel and plimit. 6 gain_ms_sel i gain and master/slave mode setting pin 7 in2p i positive input pin for ch 2 8 in2n i negative input pin for ch 2 9 sync i/o clock input/output pin to synchronize multiple class d amplifiers 1 2 4 + - - + 30 k ~ 127 .9k 202 .1k ~ 300 k 30 k ~ 127 .9k 202 .1k ~ 300 k 3 4 + - 100 k 100 k 5 4 27 200 k 6 4 2k 7 8 4 + - - + 30 k ~ 127 .9k 202 .1k ~ 300 k 30 k ~ 127 .9k 202 .1k ~ 300 k 9 4 100 k 5 downloaded from: http:///
4/ 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV pin description C continued 10 fsel0 i pwm frequency setting pin 0 11 fsel1 i pwm frequency setting pin 1 12 fsel2 i pwm frequency setting pin 2 13 mutex i speaker output mute control pin h: mute off l: mute on 14 nc - non connection 15 vccp2 - power supply pin for ch 2 pwm signal please connect a capacitor. 16 bsp2n o boot-strap pin of ch 2 negative pwm signal please connect a capacitor. 17 out2n o output pin of ch 2 negative pwm signal please connect to output lpf. 18 gndp2 - gnd pin for ch 2 pwm signal 19 out2p o output pin of ch 2 positive pwm signal please connect to output lpf. 20 bsp2p o boot-strap pin of ch 2 positive pwm signal please connect a capacitor. 21 bsp1n o boot-strap pin of ch 1 negative pwm signal please connect a capacitor. 22 out1n o output pin of ch 1 negative pwm signal please connect to output lpf. 23 gndp1 - gnd pin for ch 1 pwm signal 24 out1p o output pin of ch 1 positive pwm signal please connect to output lpf. 25 bsp1p o boot-strap pin of ch 1 positive pwm signal please connect a capacitor. 26 vccp1 - power supply pin for ch 1 pwm signal please connect a capacitor. 27 vcca - power supply pin for analog signal please connect a capacitor. 28 nc - non connection 29 rega o internal power supply pin for gate driver please connect a capacitor. the rega terminal of BD28412MUV should not be used as external supply. therefore, do not connect anything except the capacitor for stabilization. 30 test i test pin please connect to gnd. 10 4 100 k 11 4 100 k 5 12 , 13 4 100 k 17 , 19 18 16 , 20 15 5 22 , 24 23 21 , 25 26 5 30 4 100 k 29 4 27 180 k downloaded from: http:///
5/ 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV pin description C continued 31 pdx i power down setting pin h: active l: standby 32 errorx o error flag pin please connect to pull-up resistor. h : normal l : error detected an error flag occurs when output short protection, dc voltage protection , or high temperatur e protection is activated. this flag shows ic condition during operation. the numerical value of internal equivalent circuit is typical value, not g uaranteed value. 31 4 27 55 k 45 k 32 4 500 downloaded from: http:///
6/ 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV block diagram 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 32 31 30 29 28 27 26 25 17 18 19 20 21 22 23 24 in1p in1n plimit gnda regg gain_ms_sel in2p in2n sync fsel0 fsel1 fsel2 mutex nc vccp2 bsp2n gndp1 out1n bsp1n bsp2p out2p gndp2 out2n errorx pdx test rega nc vccp1 bsp1p osc regg regg regg driver fet driver fet driver fet driver fet regg pwm pwm plimit gain protect control i/f out1p vcca control i/f ldo ldo figure 3. block diagram downloaded from: http:///
7/ 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV absolute maximum ratings (tj = 25c) parameter symbol rating unit conditions supply voltage (note 1) v ccmax -0.3 to +15 .5 v vcca,vccp1,vccp2 input voltage1 (note 1) v in -0.3 to +7 v in1p, in1n, in2p, in2n, plimit, gain_ms_sel, plimit, sync (note 2) , fsel0, fsel1, fsel2, pdx, mutex input voltage2 (note 1) v err -0.3 to +7 v errorx pin voltage1 (note 1) (note 3) v pin1 -0.3 to +v ccmax v out1p, out1n, out2p, out2n operating temperature range topr - 25 to +85 c storage temperature range tstg - 55 to +150 c junction temperature range tj -40 to +150 c (note 1) the voltage that can be applied reference to gnd (pin4, 18, 2 3) . (note 2) sync pin is i/o pin. it is specified for input mode. (note 3 ) please use under this rating including the ac peak waveform (oversho ot) for all conditions. only undershoot is allowed at condition of 15.5v by the vcc reference and 10nsec (cf. figure 4) figure 1. overshoot and undershoot caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. thermal resistance (note 4) parameter symbol thermal resistance (typ) unit 1s (note 6 ) 2s2p (note 7) vqfn032v5050 junction to ambient ja 138.9 39.1 c/w junction to top characterization parameter (note 5) jt 11 5 c/w (note 4) based on jesd51-2a(still-air) (note 5) the thermal characterization parameter to report the d ifference between junction temperature and the temperature a t the top center of the outside surface of the component pack age. (note 6) using a pcb board based on jesd51- 3. layer number of measurement board material board size single fr -4 114.3mm x 76.2mm x 1.57mm copper pattern thickness footprints and traces 70m (note 7) using a pcb board based on jesd51-5, 7. layer number of measurement board material board size thermal via (n ote 8) pitch diameter 4 layers fr -4 114.3mm x 76.2mm x 1.6mm 1.20mm 0.30mm 15.5v (max) 15.5v (max) gnd v cc Q 10 nsec overshoot from gnd undershoot from v cc downloaded from: http:///
8/ 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70m 74.2mm x 74.2mm 35m 74.2mm x 74.2mm 70m (note 8) this thermal via connects with the copper pattern of all layer s.. use a thermal design that allows for a sufficient margin in consideration of power dissipation under actual operati ng conditions. this ic exposes its frame at the backside of package. note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation effici ency. try to occupy as wide as possible with heat diss ipation pattern not only on the board surface but also the backside. recommended operating conditions (t a = - 25 c to +85 c ) parameter symbol min typ max unit conditions supply voltage v in 4.5 - 13 v vcca, vccp1, vccp2 load impedance (note 9) r l1 5.4 - - btl r l2 3.2 - - pbtl high level input voltage v ih 2.0 - 3.3 v fsel0, fsel1, fsel2, mutex, pdx low level input voltage v il 0 - 0.8 v fsel0, fsel1, fsel2, mutex, pdx low level output voltage v ol - - 0.8 v errorx , i ol =0.5ma (note 9) tj<150 c downloaded from: http:///
9/ 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV electrical characteristics (unless otherwise specifi ed , ta=25c, v cc = 11 v, f pwm =600khz, f in =1khz, r l =8 , pdx=3.3v, mutex=3.3v, plimt= 0v , gain=26db, output lc filter: l=15h, c=1f when v cc >11v, snubber circuit is added: c=680pf, r=5.6 ) parameter symbol min typ max unit conditions quiescent standby current i cc1 - 0.1 25 a no load or filter, pd x= l, mutex=l quiescent mute current i cc2 - 10 20 ma no load or filter, pd x= h, mutex=l quiescent operating current i cc3 - 16 32 ma no load or filter , no signal, pd x= h, mutex=h regulator output voltage v regg 4. 45 5.55 6.05 v pd x= h, mutex=h input impedance 1 r in1 50 - - k mutex, pdx, fsel0, fsel1, fsel2, sync(slave mode only), input impedance 2 r in2 140 200 260 k plimit output power (note 10 ) p o1 - 9 - w v cc = 12 v, thd +n =10% gain 1 (note 10 ) g v1 19 20 21 db po=1w, gain_ms_sel= 0v gain 2 (note 10 ) g v2 25 26 27 db p o =1w , gain_ms_sel= 2/9 v regg gain 3 (note 10 ) g v3 31 32 33 db p o =1w, gain_ms_sel= 3/9 v regg gain 4 (note 10 ) g v4 35 36 37 db p o =1w, gain_ms_sel= 4/9 v regg total harmonic distortion (note 10 ) thd - 0.03 - % po=1w, bw=aes17 crosstalk (note 10 ) ct 60 10 0 - db po=1w, 1khz bpf psrr (note 10 ) psrr - 55 - db v ripple =0.2 v p-p , f=1khz output noise vo ltage (note 10 ) v no - - 80 -70 dbv po=0w, bw=a-weight pwm (pulse width modulation) frequency f pwm1 1128 1200 1272 khz fsel2=h, fsel1=h, fsel0=h f pwm2 940 1000 1060 khz fsel2=h, fsel1=h, fsel0=l f pwm3 564 600 636 khz fsel2=h, fsel1=l, fsel0=h f pwm4 470 500 530 khz fsel2=h, fsel1=l, fsel0=l f pwm5 376 400 424 khz fsel2=l, fsel1=h, fsel0=h (note 10 ) the value is specified as typical application. actual value depends on pcb la yout and external components. downloaded from: http:///
10 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV typical performance curves (unless otherwise specified, ta=25c, v cc =11v, f pwm =600khz, f in =1khz, pdx=3.3v, mutex=3.3v, plimt=0v, gain=26db, output lc filter: l=15h, c=1f when v cc >11v, snubber circuit is added: c=680pf, r=5.6 ) figure 7. efficiency vs output power (r l =8 ) 0 10 20 30 40 50 60 70 80 90 100 0 2 4 6 8 10 12 14 efficiency [%] output power [w/ch] v cc =5v v cc =9v v cc =12v r l =8 figure 8. efficiency vs output power (r l =6 ) 0 10 20 30 40 50 60 70 80 90 100 0 2 4 6 8 10 12 14 efficiency [%] output power [w/ch] r l =6 v cc =5v v cc =9v v cc =12v figure 5. current consumption vs supply voltage (p ower down) 0 1 2 3 4 5 6 7 8 9 10 4 6 8 10 12 14 supply voltage : v cc [v] current consumption : i cc1 [a] no load or filter no signal power down r l =8 0 5 10 15 20 25 30 35 40 45 4 6 8 10 12 14 current consumption : i cc2 , i cc3 [ma] supply voltage : v cc [v] figure 6 . current consumption vs supply voltage (mute, active) no load or filter no signal mute active r l =8 active with snubber mute active without snubber downloaded from: http:///
11 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV typical performance curves - continued (unless otherwise specified, ta=25c, v cc =11v, f pwm =600khz, f in =1khz, pdx=3.3v, mutex=3.3v, plimt=0v, gain=26db, output lc filter: l=15h, c=1f when v cc >11v, snubber circuit is added: c=680pf, r=5.6 ) 0 2 4 6 8 10 12 14 16 18 20 22 24 4 6 8 10 12 14 supply voltage : v cc [v] output power [w/ch] 0 10 20 30 40 50 60 70 80 90 100 0 2 4 6 8 10 12 14 16 18 20 22 efficiency [%] output power [w/ch] figure 9. efficiency vs output power (pbtl, r l =4 ) pbtl r l =4 output lc filter: l=10 h, c= 2.2 f v cc =5v v cc =9v v cc =12v figure 12 . output power vs supply voltage (pbtl, r l =4 ) pbtl r l =4 output lc filter: l=10 h, c= 2.2 f thd+n=10% thd+n=1% supply voltage : v cc [v] output power [w/ch] 0 2 4 6 8 10 12 14 16 4 6 8 10 12 14 supply voltage : v cc [v] output power [w/ch] figure 11 . output power vs supply voltage (r l =6 ) r l =6 thd+n=10% thd+n=1% supply voltage : v cc [v] output power [w/ch] 0 2 4 6 8 10 12 14 16 4 6 8 10 12 14 supply voltage : v cc [v] output power [w/ch] thd+n=10% thd+n=1% figure 10 . output power vs supply voltage (r l =8 ) r l =8 output power [w/ch] supply voltage : v cc [v] downloaded from: http:///
12 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV typical performance curves - continued (unless otherwise specified, ta=25c, v cc =11v, f pwm =600khz, f in =1khz, pdx=3.3v, mutex=3.3v, plimt=0v, gain=26db, output lc filter: l=15h, c=1f when v cc >11v, snubber circuit is added: c=680pf, r=5.6 ) 0 0.5 1 1.5 2 2.5 0 2 4 6 8 10 12 14 current comsumption : i cc [a] output power [w/ch] figure14. current consumption vs output power (r l =6 ) r l =6 v cc =5v v cc =9v v cc =12v current consumption : i cc [a] 0 0.5 1 1.5 2 2.5 0 2 4 6 8 10 12 14 current consumption : i cc [a] output power [w/ch] figure 13. current consumption vs output power (r l =8 ) r l =8 v cc =5v v cc =9v v cc =12v current consumption : i cc [a] 0 0.5 1 1.5 2 2.5 0 2 4 6 8 10 12 14 16 18 20 22 current consumption : i cc [a] output power [w/ch] figure15 . current consumption vs output power (pbtl, r l =4 ) v cc =5v v cc =9v v cc =12v pbtl r l =4 output lc filter: l=10 h, c= 2.2 f current consumption : i cc [a] downloaded from: http:///
13 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV typical performance curves - continued (unless otherwise specified, ta=25c, v cc =11v, f pwm =600khz, f in =1khz, pdx=3.3v, mutex=3.3v, plimt=0v, gain=26db, output lc filter: l=15h, c=1f when v cc >11v, snubber circuit is added: c=680pf, r=5.6 ) - 140 - 120 - 100 - 80 - 60 - 40 - 20 0 10 100 1k 10k 100k noise fft [dbv] freq [hz] no signal r l =8 out1 out2 figure16 . fft of output noise voltage vs frequency (r l =8 ) frequency [hz] fft of output noise voltage [dbv] 16 21 26 31 36 10 100 1k 10k 100k voltage gain [db] freq [hz] figure17. voltage gain vs frequency (r l =8 ) p o =1w r l =8 out1 out2 frequency [hz] voltage gain [db] 0.001 0.01 0.1 1 10 10 100 1k 10k 100k thd+n [%] freq [hz] out1 out2 figure19. thd+n vs frequency (r l =8 ) p o =1w filter : aes17 r l =8 frequency [hz] 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 thd+n [%] po [w] f in =6khz f in =100hz f in =1 k hz figure18. thd+n vs output power (r l =8 ) f in =1khz f in =100hz f in =6khz filter : aes17 r l =8 output power : po [w] downloaded from: http:///
14 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV typical performance curves - continued (unless otherwise specified, ta=25c, v cc =11v, f pwm =600khz, f in =1khz, pdx=3.3v, mutex=3.3v, plimt=0v, gain=26db, output lc filter: l=15h, c=1f when v cc >11v, snubber circuit is added: c=680pf, r=5.6 ) - 120 - 100 - 80 - 60 - 40 - 20 0 10 100 1k 10k 100k crosstalk [db] freq [hz] out1 to out2 out2 to out1 p o =1w r l =8 figu re 21 . crosstalk vs frequency (r l =8 ) frequency [hz] - 120 - 100 - 80 - 60 - 40 - 20 0 0.01 0.1 1 10 100 crosstalk [db] po [w] out1 to out2 out2 to out1 r l =8 figure 20 . crosstalk vs output power (r l =8 ) output power : po [w] - 140 - 120 - 100 - 80 - 60 - 40 - 20 0 10 100 1k 10k 100k noise fft [dbv] freq [hz] no signal r l =6 out1 out2 figure 22 . fft of output noise voltage vs frequency (r l =6 ) frequency [hz] fft of output noise voltage [dbv] 16 21 26 31 36 10 100 1k 10k 100k voltage gain [db] freq [hz] p o =1w r l =6 out1 out2 figure 23. voltage gain vs frequency (r l =6 ) frequency [hz] voltage gain [db] downloaded from: http:///
15 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV typical performance curves - continued (unless otherwise specified, ta=25c, v cc =11v, f pwm =600khz, f in =1khz, pd x=3.3v, mutex=3.3v, plimt=0v, gain=26db, output lc filter: l=15h, c=1f when v cc >11v, snubber circuit is added: c=680pf, r=5.6 ) - 120 - 100 - 80 - 60 - 40 - 20 0 10 100 1k 10k 100k crosstalk [db] freq [hz] out1 to out2 out2 to out1 p o =1w r l =6 figure 27. crosstalk vs frequency (r l =6 ) frequency [hz] - 120 - 100 - 80 - 60 - 40 - 20 0 0.01 0.1 1 10 100 crosstalk [db] po [w] out1 to out2 out2 to out1 r l =6 figure 26. crosstalk vs output power (r l =6 ) output power : po [w] 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 thd+n [%] po [w] filter : aes17 r l =6 f in =6khz f in =100hz f in =1 k hz f in =1khz f in =100hz f in =6khz figure 24. thd+n vs output power (r l =6 ) output power : po [w] 0.001 0.01 0.1 1 10 10 100 1k 10k 100k thd+n [%] freq [hz] p o =1w filter : aes17 r l =6 out1 out2 figure 25. thd+n vs frequency (r l =6 ) frequency [hz] downloaded from: http:///
16 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV typical performance curves - continued (unless otherwise specified, ta=25c, v cc =11v, f pwm =600khz, f in =1khz, pdx=3.3v, mutex=3.3v, plimt=0v, gain=26db, output lc filter: l=10 h , c=2.2 f when v cc >11v, snubber circuit is added: c=680pf, r=5.6 ) 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 thd+n [%] po [w] figure 30 . thd+n vs output power (pbtl, r l =4 ) filter : aes17 pbtl r l =4 f in =6khz f in =100hz f in =1 k hz f in =1khz f in =100hz f in =6khz output power : po [w] 0.001 0.01 0.1 1 10 10 100 1k 10k 100k thd+n [%] freq [hz] figure 31 . thd+n vs frequency (pbtl, r l =4 ) p o =1w filter : aes17 pbtl r l =4 frequency [hz] - 140 - 120 - 100 - 80 - 60 - 40 - 20 0 10 100 1k 10k 100k noise fft [dbv] freq [hz] figure 28 . fft of output noise voltage vs frequency (pbtl, r l =4 ) no signal pbtl r l =4 frequency [hz] fft of output noise voltage [dbv] 16 21 26 31 36 10 100 1k 10k 100k voltage gain [db] freq [hz] figure 29. voltage gain vs frequency (pbtl, r l =4 ) p o =1w pbtl r l =4 frequency [hz] voltage gain [db] downloaded from: http:///
17 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV typical performance curves - continued (unless otherwise specified, ta=25c, v cc =11v, f in =1khz, pdx=3.3v, mutex=3.3v, plimt=0v, gain=26db, output lc filter: l=15h, c=1f when v cc >11v, snubber circuit is added: c=680pf, r=5.6 ) figure 32 . fft of output noise voltage vs frequency (f pwm =400khz, r l =8 ) figure 33. voltage gain vs frequency (f pwm =400khz, r l =8 ) 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 thd+n [%] output power : p o [w] f pwm =400khz filter : aes17 r l =8 f in =6khz f in =100hz f in =1khz f in =100hz f in =6khz f in =1 k hz 0.001 0.01 0.1 1 10 10 100 1k 10k 100k thd+n [%] frequency [hz] f pwm =400khz p o =1w filter : aes17 r l =8 out1 out2 out2 out1 16 21 26 31 36 10 100 1k 10k 100k voltage gain [db] frequency [hz] figure 34 . thd+n vs output power (f pwm =400khz, r l =8 ) figure 35. thd+n vs frequency (f pwm =400khz, r l =8 ) - 140 - 120 - 100 - 80 - 60 - 40 - 20 0 10 100 1k 10k 100k fft of output noise voltage [dbv] frequency [hz] f pwm =400khz no signal r l =8 out1 out2 f pwm =400khz downloaded from: http:///
18 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV typical performance curves - continued (unless otherwise specified, ta=25c, v cc =11v, f in =1khz, pdx=3.3v, mutex=3.3v, plimt=0v, gain=26db, output lc filter: l=15h, c=1f when v cc >11v, snubber circuit is added: c=680pf, r=5.6 ) figure 36. crosstalk vs output power (f pwm =400khz, r l =8 ) figure 37. crosstalk vs frequency (f pwm =400khz, r l =8 ) - 120 - 100 - 80 - 60 - 40 - 20 0 0.01 0.1 1 10 100 crosstalk [db] output power : p o [w] out1 to out2 out2 to out1 f pwm =400khz r l =8 - 120 - 100 - 80 - 60 - 40 - 20 0 10 100 1k 10k 100k crosstalk [db] frequency [hz] out1 to out2 out2 to out1 f pwm =400khz p o =1w r l =8 downloaded from: http:///
19 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV application information 1. power up / down sequence vccp1 vccp2 speaker btl output (after lc filter) power up vccp1, vccp2, vcca simultaneously. t t input audio signal. t t mutex t in1p in1n in2p in2n out1p out1n out2p out2n pdx after vcc rises, please set pdx to high. t vcca more than 200msec after input rises, please set mutex to high. stop audio signal. set pdx to low. power down vccp1, vccp2, vcca simultaneously. after input signal stops, please set mutex to low. figure 38. power up / down sequence downloaded from: http:///
20 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV 2. function description (1) power down and mute setting pd x mutex normal error detection pwm output out1p, 1n, 2p, 2n errorx (note 12) pwm output out1p, 1n, 2p, 2n errorx (note 12) l l/h high-z_low (note 11 ) (power down) h high-z_low (note 11 ) (power down) h h l high-z_low (n ote 11 ) (mute_on) h high-z_low (note 11 ) (mute_on) l h h active (mute_off) h high-z_low (note 11 ) (mute_on) l (note 11 ) all power transistors are off and output terminals are pulled dow n by 40k (typ). (note 12) errorx pin is pulled up by 10 k resistor. (2) gain and master/slave setting master/slave and gain are set by gain_ms_sel pin voltage. r6a (note 13) (to regg) r6b (note 13) (to gnd) master/slave gain input impedance (in1p,in1n,in2p,in2n) 18k o pen slave 36db 30k (typ) 18k 68k slave 32db 45.1k (typ) 33k 68k slave 26db 79.3k (typ) 51k 68k slave 20db 127.9k (typ) 68k 51k master 36db 30k (typ) 68k 33k master 32db 45.1k (typ) 68k 18k master 26db 79.3k (typ) open 18k master 20db 127.9k (typ) setting cannot be changed when ic is active, but it can be set by rebooting ( pd x=h to l to h). master/slave function this ic has master and slave mode, and it can be synch ronized by pwm frequency between two ics. in master mode, sync pin becomes output pin for synchronization and i n slave mode it becomes input pin, thus ensure that each sync pins are connected . also, same se tting for fsel2/fsel1/fsel0 pins must be secured. (3) parallel btl function parallel btl mode can be set by connecting in2p and in2n pins to gn d. please short out1p C out2p, out1n C out2n near the ic as much as possible. parallel btl mode cannot be set by connecting in1p and in1n pins to gn d. in1p in1n in2p in2n out1n out2p out2n out1p in1p in1n in2p in2n out1n out2p out2n out1p differential input differential input figure 39. gain_ms_sel pin setting stereo btl mode parallel btl mode figure 40 . parallel btl mode (note 13 ) please use 1% tolerance resistor. regg gain_ ms _ sel r6a r6b regg downloaded from: http:///
21 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV (4) power limit function it is possible to limit the maximum output voltage by plimit pin for protection of speaker. speaker output output voltage soft clip 5 3 plimit regg plimit ldo r3a r3b 1f c5 29 ldo 0.1f c29 rega r in2 output wave is clipped like figure 37. by applying the dc voltag e to 3pin (plimit), and output power is limited. figure 41 shows the relation between limited output power p lim and 3pin (plimit) pin voltage v plimit . v plimit is set by using external resistance r3a and r3b. setting examples of r3a a nd r3b is showed below. if you don t use the power limit function, connect 3pin (plimit) to gnd. r3a [ ] r3b [ ] max output power p lim [w] (r l =8 ) m in t yp m ax open short to gnd - (unlimited) - 12k 20k 3.4 6.8 13.6 10k 20k 2.5 5 10 8.2k 20k 1.7 3.4 6.8 when you use the power limit function in the setting except the table, p lim is l plimit rega lim r v v p 2 8. 39 ) - ( 2 ? ? regg 2 in b3 a3 a3 plimit v ) r 1 + r 1 + r 1 ( r 1 = v . figure 41 . power limit figure 42 . limited output power vs plimit pin voltage 0 2 4 6 8 10 12 0 2 4 6 limited output power p lim [w] plimit pin voltage v plimit [v] plimit pin voltage : v plimit [v] limited output power : p lim [w] v cc =12v r l =8 figure 43 . plimit pin setting typ downloaded from: http:///
22 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV where: v rega is the voltage of 29pin (rega), 5v(typ) v regg is the voltage of 5pin (regg), 5.55v(typ) r in2 is pull-down resistance of 3pin (plimit), 200k (typ) set the r3a and r3b to become the limited power. (5) fsel2 / fsel1 / fsel0 (am avoidance function) fsel2 / fsel1 / fsel0 pins are us ed for pwm frequency setting . they can change the pwm frequency like below. do not set following conditions to become un-recommended freque ncy: fsel2=l, fsel1=h, fsel0=l fsel2=l, fsel1=l, fsel0=h fsel2=fsel1=fsel0=l (6) am avoidance function pwm frequency is near to am radio frequency band therefore th is makes interference during am radio is used, and may negatively affects reception of am radio wave. this in terference can be reduced by adjusting pwm frequency. below are the recommended settings. example, for re ceiving am radio wave of 1269khz in asia / europe, pwm frequency must be set to 500khz. fsel2 fsel1 fsel0 pwm frequency h h h 1200khz (typ) h h l 1000khz (typ) h l h 600khz (typ) h l l 500khz (typ) l h h 400khz (typ) am frequency [khz] recommended pwm frequency setting americas asia / europe f pwm =400khz fsel2=l fsel1=h fsel0=h f pwm =500khz fsel2=h fsel1=l fsel0=l f pwm =6 00khz fsel2=h fsel1=l fsel0=h f pwm =1000khz fsel2=h fsel1=h fsel0=l f pwm = 12 00khz fsel2=h fsel1=h fsel0=h 522 C 540 - 540 C 917 540 C 914 - - 917 C 1125 914 C 1122 - - 1125 C 1375 1122 C 1373 - - - 1375 C 1547 1373 C 1548 - 1547 C 1700 1548 C 1701 - downloaded from: http:///
23 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV 3. application information (1) application circuit example 1 (stereo btl, v cc =4.5v to 11v) overshoot of output pwm differs depending on the board , etc. ensure that it is lower than absolute maximum ratings. if it exceeds the absolute maximum ratings, snubber ci rcuit need to be added, the circuit example is shown on the next page. 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 32 31 30 29 28 27 26 25 17 18 19 20 21 22 23 24 in1p in1n plimit regg gain_ms_sel gnda in2p in2n sync fsel0 fsel1 fsel2 nc bsp2n gndp1 out1n out2p gndp2 out2n errorx pdx test rega nc osc regg regg regg driver fet driver fet driver fet driver fet regg pwm pwm plimit gain protect control i/f 3.3v 10k 15h 15h 15h 15h audio source regg regg out1p mutex control i/f ldo 1f 1f 1f 1f 1f 1f 1f 1f 1f rl=8 /6 rl=8 /6 c24a c22a c19a c17a c8 c7 c5 c1 r32 r3a r6b r3b r6a l17a l19a l22a l24a c2 regg bsp1p vccp1 10f 0.1f vcca 4.7f 0.1f c27a c27b c26b c26a vcc vcc bsp1n bsp2p 2.2f 2.2f c21 c20 vccp2 0.1f 10f c15a c15b vcc 2.2f 2.2f c25 c16 ldo 0.1f c29 to mcu figure 44. application circuit 1 bom 1 (stereo btl, v cc =4.5v to 11v) parts qty. parts no. description resistor 1 r3a ref. function description (4)power limit function 1 r3b 1 r6a ref. function description (2)gain and master/slave setting 1 r6b 1 r32 1 0k , 1/16w , j( 5%) capacitor 4 c1, c2, c7, c8 1f , 16v, b(10%) 1 c5 (note 14) 1f , 16v, b(10%) 3 c15a, c26a, c27a (note 14) 0.1f , 25v, b(10%) 2 c15b, c26b (note 14) 10f , 25v, b(10%) 4 c16, c20, c21, c25 (note 14) 2.2f , 16v, b(10%) 4 c17a, c19a, c22a, c24a 1f , 25v, b(10%) 1 c27b (note 14) 4.7f , 25v, b(10%) 1 c29 (note 14) 0.1f , 16v, b(10%) inductor 4 l17a, l19a, l22a, l24a 15h , 2.1a, 20% (note 14) please place it near pin as much as possible. downloaded from: http:///
24 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV (2) application circuit example 2 (stereo btl, v cc =11v to 13v) please add the snubber circuit at out pin when v cc =11v to 13v. 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 32 31 30 29 28 27 26 25 17 18 19 20 21 22 23 24 in1p in1n plimit regg gain_ms_sel gnda in2p in2n sync fsel0 fsel1 fsel2 nc bsp2n gndp1 out1n out2p gndp2 out2n errorx pdx test rega nc bsp1p osc regg regg regg driver fet driver fet driver fet driver fet regg pwm pwm plimit gain protect control i/f 3.3v 10k 15h 15h 15h 15h audio source regg regg out1p mutex control i/f ldo 1f 1f 1f 1f 1f 1f 1f 1f rl=8 /6 rl=8 /6 c24a c22a c19a c17a c8 c7 c1 r32 r3a r6b r3b r6a l17a l19a l22a l24a 680pf 680pf 5.6 5.6 c24c c22c r24 r22 c2 680pf 680pf 5.6 5.6 c19c c17c r19 r17 vccp2 0.1f c15a vcc vccp1 10f 0.1f vcca 4.7f 0.1f c27a c27b c26b c26a vcc vcc bsp1n bsp2p 2.2f 2.2f c21 c20 2.2f 2.2f c25 c16 1f c5 regg ldo 0.1f c29 to mcu 10f c15b figure 45 . application circuit 2 bom 2 (stereo btl , v cc = 11 v to 1 3v ) parts qty. parts no. description resistor 1 r3a ref. function description (4)power limit function 1 r3b 1 r6a ref. function description (2)gain and master/slave setting 1 r6b 1 r32 1 0k , 1/16w , j( 5%) 4 r17, r19, r22, r24 5.6 , 1/10w , j( 5%) capacitor 4 c1, c2, c7, c8 1f , 16v, b(10%) 1 c5 (note 15) 1f , 16v, b( 10%) 3 c15a, c26a, c27a (note 15) 0.1f , 25v, b(10%) 2 c15b, c26b (note 15) 10f , 25v, b(10%) 4 c16, c20, c21, c25 (note 15) 2.2f , 16v, b(10%) 4 c17a, c19a, c22a, c24a 1f , 25v, b(10%) 4 c17c, c19c, c22c, c24c (note 15) 680pf, 25v, b(10%) 1 c27b (note 15) 4.7f , 25v, b(10%) 1 c29 (note 15) 0.1f , 16v, b(10%) inductor 4 l17a, l19a, l22a, l24a 15h , 2.1a, 20% (note 15) please place it near pin as much as possible. s nu bber circuit downloaded from: http:///
25 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV (3) application circuit example 3 (monaural pbtl , v cc =4.5v to 11v) overshoot of output pwm differs depending on the board, e tc. ensure that it is lower than absolute maximum ratings. if it exceeds the absolute maximum ratings, snubber c ircuit need to be added, the circuit example is shown on the next page. 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 32 31 30 29 28 27 26 25 17 18 19 20 21 22 23 24 in1p in1n plimit regg gain_ms_sel gnda in2p in2n sync fsel0 fsel1 fsel2 nc bsp2n gndp1 out1n bsp1n bsp2p out2p gndp2 out2n errorx pdx test rega nc bsp1p osc regg regg regg driver fet driver fet driver fet driver fet regg pwm pwm plimit gain protect control i/f 3.3v 10k 10h 10h 2.2f audio source regg regg out1p mutex control i/f ldo 2.2f 2.2f 2.2f 1f 1f rl=4 c24b c22b c21 c20 c1 r32 r3a r6b r3b r6a l22b l24b c2 vccp2 0.1f 10f c15a c15b vcc vccp1 10f 0.1f vcca 4.7f 0.1f c27a c27b c26b c26a vcc vcc 2.2f 2.2f c25 c16 1f c5 regg ldo 0.1f c29 to mcu figure 46 . application circuit 3 bom 3 (monaural pbtl , v cc =4.5v to 11v) parts qty. parts no. description resistor 1 r3a ref. function description (4)power limit function 1 r3b 1 r6a ref. function description (2)gain and master/slave setting 1 r6b 1 r32 1 0k , 1/16w , j( 5%) capacitor 2 c1, c2 1f , 16v, b(10%) 1 c5 (note 16) 1f , 16v, b(10%) 3 c15a, c26a, c27a (note 16) 0.1f , 25v, b(10%) 2 c15b, c26b (note 16) 10f , 25v, b(10%) 4 c16, c20, c21, c25 2.2f , 16v, b(10%) 2 c22b, c24b (note 16) 2.2f , 25v, b(10%) 1 c27b 4.7f , 25v, b(10%) 1 c29 (note 16) 0.1f , 16v, b(10%) inductor 2 l22b, l24b 10h , 2.6a, 20% (note 16) please place it near pin as much as possible. downloaded from: http:///
26 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV (4) application circuit example 4 (monaural pbtl , v cc =11v to 13v) please add the snubber circuit at out pin when v cc =11v to 13v. 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 32 31 30 29 28 27 26 25 17 18 19 20 21 22 23 24 in1p in1n plimit regg gain_ms_sel gnda in2p in2n sync fsel0 fsel1 fsel2 nc bsp2n gndp1 out1n bsp1n bsp2p out2p gndp2 out2n errorx pdx test rega nc bsp1p osc regg regg regg driver fet driver fet driver fet driver fet regg pwm pwm plimit gain protect control i/f 10k 10h 10h audio source regg regg out1p mutex control i/f ldo 2.2f 2.2f 1f 1f rl=4 c24b c22b c1 r32 r3a r6b r3b r6a l22b l24b 680pf 680pf 5.6 5.6 c24c c22c r24 r22 c2 3.3v vccp2 0.1f 10f c15a c15b vcc 2.2f 2.2f c21 c20 vccp1 10f 0.1f vcca 4.7f 0.1f c27a c27b c26b c26a vcc vcc 2.2f 2.2f c25 c16 1f c5 regg ldo 0.1f c29 to mcu figure 47 . application circuit 4 bom 4 (monaural pbtl , v cc =11v to 13v) parts qty. parts no. description resistor 1 r3a ref. function description (4)power limit function 1 r3b 1 r6a ref. function description (2)gain and master/slave setting 1 r6b 1 r32 1 0k , 1/16w , j(5%) 2 r22, r24 (note 17) 5.6 , 1/10w , j(5%) capacitor 2 c1, c2 1f , 16v, b(10%) 1 c5 (note 17) 1f , 16v, b(10%) 3 c15a, c26a, c27a (note 17) 0.1f , 25v, b(10%) 2 c15b, c26b (note 17) 10f , 25v, b(10%) 4 c16, c20, c21, c25 (note 17) 2.2f , 16v, b(10%) 2 c22b, c24b 2.2f , 25v, b(10%) 2 c22c, c24c (note 17) 680pf, 25v, b(10%) 1 c27b (note 17) 4.7f , 25v, b(10%) 1 c29 (note 17) 0.1f , 16v, b(10%) inductor 2 l22b, l24b 10h , 2.6a, 20% (note 17) please place it near pin as much as possible. downloaded from: http:///
27 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV (5) application example 5 (master/slave mode, v cc =4.5v to 11v) 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 32 31 30 29 28 27 26 25 17 18 19 20 21 22 23 24 in1p in1n plimit regg gain_ms_sel gnda in2p in2n sync fsel0 fsel1 fsel2 nc bsp2n gndp1 out1n bsp1n bsp2p out2p gndp2 out2n errorx pdx test rega nc bsp1p osc regg regg regg driver fet driver fet driver fet driver fet regg pwm pwm plimit gain protect control i/f 3.3v 100k 10h 10h audio source regg2 regg2 out1p mutex control i/f ldo 2.2f 2.2f 1f 1f rl=4 c24bs c22bs c1s r32s r3as r6bs r3bs r6as l22bs l24bs c2s 9 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 32 31 30 29 28 27 26 25 17 18 19 20 21 22 23 24 in1p in1n plimit regg gain_ms_sel gnda in2p in2n sync fsel0 fsel1 fsel2 nc bsp2n gndp1 out1n bsp1n bsp2p out2p gndp2 out2n errorx pdx test rega nc bsp1p osc regg regg regg driver fet driver fet driver fet driver fet regg pwm pwm plimit gain protect control i/f 3.3v 100k 15h 15h 15h 15h 2.2f audio source regg1 regg1 out1p mutex control i/f ldo 1f 1f 1f 1f 2.2f 1f 1f 1f 1f rl=8 /6 rl=8 /6 c24am c22am c21m c20m c19am c17am c8m c7m c1m r32m r3am r6bm r3bm r6am l17am l19am l22am l24am c2m vccp2 0.1f 10f c15am c15bm vcc vccp1 10f 0.1f vcca 4.7f 0.1f c27am c27bm c26bm c26am vcc vcc vccp2 0.1f 10f c15as c15bs vcc 2.2f 2.2f c25s c16s 2.2f 2.2f c25m c16m 2.2f 2.2f c21s c20s vccp1 10f 0.1f vcca 4.7f 0.1f c27as c27bs c26bs c26as vcc vcc 1f c5m regg1 1f c5s regg2 ldo 0.1f c29s ldo 0.1f c29m to mcu to mcu master stereo btl slave monaural pbtl figure 48. application circuit 5 this gain_ms_sel setting is one example, so another gain setting can be used. downloaded from: http:///
28 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV 4. about the protection function protection function detecting & releasing condition pwm output out1p, 1n, 2p, 2n errorx (note 18) output short protection detecting condition detecting current = 8a (t yp ) high-z_low (latch) (note19) l (latch) (note19) dc voltage protection de tecting condition dc voltage is over 3.5v for a period of 0.33sec to 0.66sec at speaker output high-z_low (latch) (note19) l (latch) (note19) overheat protection detecting condition chip temperature to be over 150c (t yp ) high-z_low l releasing condition chip temperature to be below 120c (t yp ) normal operation under voltage protection detecting condition power supply voltage to be below 4.0v (t yp ) high-z_low h releasing condition power supply voltage to be above 4.1v (t yp ) normal operation (note 18) errorx pin is pulled up by 10 k resistor. (note 19) once an ic is latched, the circuit is not released automatically even after an abnormal status is gone. the following procedures or is available for recovery. after turning mutex terminal to low (holding time to low = 10msec (min)) t urn back to high again. restore power supply after dropping to power supply voltage v cc < 3v (10msec (min) holding) which internal power on reset circuit activates. downloaded from: http:///
29 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV (1) output short protection (short to the power supply) this ic has pwm output short protection circuit that stops the pwm output when the output speaker (after lc -filter) is short-circuited to the power supply unintentionally. detecting condition - it will detect when mutex pin is s et high and the current that flows in to the pwm output pin becomes 8a(t yp ) or more for 250nsec (typ). if detected, the pwm output insta ntaneously goes to the state of high-z_low and ic is latch. releasing method - after turning mutex terminal to low (holding time to low = 10m sec(min)), turn back to high again. restore power supply after the voltage dropped to internal po wer on reset circuit activating power supply voltage v cc 3v (hold for 10msec (min)). tt 8a(typ) t 250nsec(typ) t short to v cc release from short to v cc pwm out ic latches with high-z_low released from latch state over-current latch release 10msec(min) errorx out1p out1n out2p out2n mutex figure 49 . output short protection sequence (short to power supply) downloaded from: http:///
30 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV (2) output short protection (short to gnd) this ic has pwm output short protection circuit that stops the p wm output when the output speaker (after lc -filter) is short-circuited to gnd unintentionally. detecting condition - it will detect when mutex pin is s et high and the current that flows in to the pwm output terminal becomes 8a(typ) or more for 250nsec (typ). if detect ed, the pwm output instantaneously goes to the state of high-z_low and ic is latc hed. releasing method - after turning mutex terminal to low (holding time to low = 10msec(min)), turn back to high again. restore power supply after the voltage dropped to internal po wer on reset circuit activating power supply voltage v cc 3v (hold for 10msec (min)). 250nsec(typ) t t t 8a(typ) t short to gnd release from short to gnd pwm out ic latches with high-z_low released from latch state latch release 10msec(min) over-current errorx out1p out1n out2p out2n mutex figure 50 . sequence of the output short protection (short to gnd) downloaded from: http:///
31 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV (3) dc voltage protection this ic is integrated with dc voltage protection circuit. w hen dc voltage is apply to the speaker unintentionally , speaker output will mute, and this protection will prevent the speaker from destruction. detecting condition - it will detect when mutex pin is se t high and speaker output is more than 3.5v(t yp ) over 0.33sec to 0.66sec. once detected, the pwm output instantaneously goes to th e state of hi gh -z_low, and ic will latch. releasing method - after turning mutex terminal to low (holding time to low = 10msec(min)), turn back to high again. restore power supply after the voltage dropped to internal power on reset circuit activating power supply voltage v cc 3v (hold for 10msec (min)). tt t t released from latch state pwm out : ic latches with high-z_low detection time t det = 0.33sec to 0.66sec latch is released abnormal condition impress dc voltage to speaker output over 3.5v release abnormal condition 10msec(min) 3.5v -3.5v speaker output errorx out1p out1n out2p out2n mutex figure 51 . dc voltage protection sequence downloaded from: http:///
32 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV (4) overheat protection this ic has overheat protection circuit that prevents thermal runaway under an abnormal state for the chip temperature exceed ed tjmax=150c. detecting condition - it will detect when mutex pin is se t high and the temperature of the chip becomes 150c (typ) or more. speaker output mutes immediately when high temperatu re protection is activated. releasing condition - it will release when mutex pin is set high and the temperature of the chip becomes 120c (typ) or less. the speaker output is back to its normal operatio n immediately when released. (auto recovery) tj speaker output high-z_low 150 c 120 c errorx tt t t out1p out1n out2p out2n figure 52 . overheat protection sequence downloaded from: http:///
33 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV (5) under voltage protection this ic has under voltage protection circuit that mutes the ou tput speaker once extreme drop in the power supply voltage is detected. detecting condition - it will detect when mutex pin is s et high and the power supply voltage becomes lower than 4v(typ).speaker output mutes immediately when under voltage protectio n is detected. releasing condition - it will release when mutex pin is set high and the power supply voltage becomes more than 4.1v(typ).the speaker output is back to its normal operat ion immediately when released. (auto recovery) high-z_low 4.1v 4v 3.3v tt tt vcca vccp1 vccp2 speaker output errorx out1p out1n out2p out2n figure 53 . under voltage protection sequence downloaded from: http:///
34 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV 5. selecting external components (1) output lc filter circuit an output filter is required to eliminate radio-frequency components exceeding the audio-frequency region supplied to a load (speaker). because this ic uses output pwm frequencies any of 400 khz, 500khz, 600khz , 1000khz or 1200khz, the high-frequency components must be appropri ately removed. this section takes an example of an lc type lpf shown below, in which coil l and capacitor c compose a differential filter with an attenuation property of -12db/oct. a large part of switching currents flow to capacitor c, and only a small part of the currents flow to speaker r l . this filter reduces unwanted emission this way. in addition, coil l and capacitor c compose a filter against in-phase comp onents, reducing unwanted emission further. use inductors with low esr and with sufficient margin of allowable currents. power lo ss will increase if inductors with high esr are used. s elec t a closed magnetic circuit type product in normal cases to p revent emission noise. use capacitors with low equivalent series resistance, and good impedance characteristics at high frequency ranges (100khz or higher). also, select an item with suffici ent voltage rating because massive amount of high -frequency current flow is expected. (2) snubber circuit constant when overshoot / undershoot of pwm output exceeds absol ute maximum rating, or when overshoot / undershoot of pwm output negatively affects emc, snubber circuit i s used as shown below. and if v cc >11v, the snubber circuit must be added. r l c r 6 680pf, 25v b( 10%) 5.6 , 1/10w j( 5% ) 8 680pf, 25v b( 10%) 5.6 , 1/10w j( 5% ) r l c r 4 680pf, 25v b( 10%) 5.6 , 1/10w j( 5% ) caution1: if the impedance characteristics of the speakers at high-frequen cy range increase rapidly, the ic might not have stable operation in the resonance frequency rang e of the lc filter. therefore, consider adding damping-circuit, etc., depending on the impedance of the spe aker. caution2: though this ic has a short protection function, when short to vcc or gnd after the lc filter, over-current occurs during short protection function operati on. be careful about over/undershoot which exceeds the maximum standard ratings because back elec tromotive force of the inductor will occur which sometimes leads to ic destruction. r l l c f c 6 , 8 15h 1f 41khz r l l c f c 4 10h 2.2f 34khz figure 54 . output lc filter pwm gndp vccp r c snubber circuit lc filter circuit out the following table shows rohm recommended value of snubber filter constants when using rohm board. the following shows output lc filter constants and cutoff frequencies f c with typical load impedances. figure 55 . snubber circuit r l c l c l out*p out*n stereo btl monaural pbtl stereo btl monaural pbtl downloaded from: http:///
35 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV (3)operating condition with the application component parameter parts no . limit unit conditions min typ max tolerance of capacitor for bsp c 16 , c 20 , c 21 , c25 1.0 (note 20) 2.2 2.95 (note 21 ) f b characteristics, 16v ceramic type capacitor recommend ed (note 20 ) should use the capacity of the capacitor not to be less than a minimum in consideration of temperature characteristics and dc -bias characteristics. (note 21 ) it is value in consideration of +/-10% of capacity unevenness, capacity r ate of change 22%. please use the capacitor within this limit. downloaded from: http:///
36 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitanc e value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. or 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short a nd thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature ratin g be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in cas e of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operati on under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the ele ctric field from the outside can easily charge it. the sma ll charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
37 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 56 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics maximum junction temperature rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to n ormal operation. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 15. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circui t that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous ope ration or transitioning of the protection circuit. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
38 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV ordering information b d 2 8 4 1 2 m u v - e 2 part number package muv: vqfn032v5050 packaging and forming specification e2: embossed tape and reel marking diagram vqfn0 32 v5050 (top view) d 2 8 4 1 2 part number marking lot number 1pin mark downloaded from: http:///
39 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV physical dimension, tape and reel information package name vqfn032v5050 downloaded from: http:///
40 / 40 tsz02201-0c1c0e900620-1-2 ? 2016 rohm co., ltd. all rights reserved. 06.jun.2016 rev.002 www.rohm.com tsz22111 ? 15 ? 001 BD28412MUV revision history date revision changes 29.jan.2016 001 new release 06.jun.2016 002 p.3 to p.5 pin description p.7 absolute maximum ratings p.7 thermal resistance p.8 thermal resistance , copper pattern p.9 electrical characteristics, input impedance 1 p.11 to p.18 typical performance curves p.19 power up / down sequence figure 38. p.21 power limit function p.23 to p.27 application circuit example p.35 operating condition with the application component add downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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